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3m ? emi/emc electronic materials solutions electronics ? emi shielding tapes ? emi grounding adhesives and gaskets ? emi absorbers ? flux field directional materials ? nfc, wireless power, magnetic shielding materials for todays
2 laptop emi/emc solutions 3m multi-functional emi shielding, grounding and heat spreading solutions for led and other heat sources device temperature management 3m ? emi absorbers ab5050/ab6005/ab7050 to reduce emi noise level within device or on flex/connector 3m ? electrically conductive adhesive transfer tape 9707/9709s/9720s/9750 for flex/pcb grounding and attachment, grounded parts assembly versus screws and clips. lower device bias, reduce fex emi interference. 3m emi absorbers ab5050/ ab6005/ab7050 to reduce the emi noise radiation from high speed devices like cpu/ mpu/memory. attach ab series sheet on the specifc noise source. 3m ? electrically conductive gasket ecg-7073 for grounding and emi shielding. end user device using nfc/rfid antenna & 3m flux field directional material (ffdm) read antenna very soft and conformable 3m ? electrically conductive foam gasket materials msg-6100 for grounding, gap flling and emi shielding 3m ? emi shielding foil and fabric tape for display grounding and emi shielding ? lcd driver emi shielding ? 3m emi shielding foil tapes 1170 and 1183 ? 3m emi shielding fabric tapes cn3490, cn3190 and cef-3t 3m emi absorbers ab7050/ab5100 to reduce emi noise within enclosure / emi faraday cage / reduce cavity resonance. attach absorber sheet on the wall of shielding parts. 3m ? flux field directional materials em16tf/rfic15 for improved nfc & rfid antenna read range performance. less eddy current losses in surrounding materials. lcd module back side control pcb cover sheet wi-wan antenna ab5010 easy-to-use shielding, absorbing, grounding and bonding technology for todays electronics the continuing trend toward designing electronic devices with smaller enclosures, denser circuits and higher speeds has made managing electromagnetic/radio frequency interference (emi/rfi) and electrostatic discharge (esd) a growing challenge for electronics manufacturers. 3m can help you meet that challenge, with a variety of advanced shielding and grounding solutions designed to help you speed assembly time reduce weightsave spacecontrol costsand give you more design fexibility. let 3m help you get connected! 3m emi absorbers ab5100/ab7050 to reduce the emi interference between lcd back panel and wi-lwan antenna
11 product backing adhesive total thickness mils (mm) features 3m ? metallized cloth 2191fr nickel on copper-plated polyester ripstop fabric acrylic conductive 5.5 ( 0.140 ) lightweight, conformable, oxidation resistant and high strength for emi shielding and grounding. easily die cut. ag-0927 silver-coated polyester fabric acrylic conductive 4.3 ( 0.110 ) lightweight, conformable, oxidation resistant and high strength for emi shielding and grounding. easily die cut. au-2190 gold-coated polyester fabric acrylic conductive 4.3 ( 0.110 ) lightweight, conformable, oxidation resistant and high strength for emi shielding and grounding. easily die cut. x-7001 copper-plated polyester ripstop fabric acrylic conductive coated on both sides 4.3 ( 0.110 ) typically used to bond two surfaces, both physically and electrically. also can provide emi shielding, static charge draining, grounding. lightweight, conformable and easily die cut. cn 3190 nickel on copper-plated polyester ripstop fabric acrylic conductive 4.3 ( 0.110 ) lightweight, conformable, oxidation resistant and high strength for emi shielding and grounding. cn3490 non-woven copper-nickel fabric acrylic conductive 2.4 (.06) lightweight, thin, conformable non-woven fabric. ideal for shielding, grounding, and static dissipation. easily die cut. cn4490 non-woven copper-nickel fabric double coated acrylic conductive 2.0 (.05) double coated with adhesive. lightweight, thin, conformable non- woven fabric. ideal for shielding, grounding, and static dissipation. ideal for use as a thin, conductive, repositionable gasket material. easily die cut. cef-6** cu/ni plated fabric acrylic conductive coated on both sides 5.5 ( 0.14 ) bonding and grounding two surfaces. emi shielding, static discharge draining. flexible and conformable design. cef-6r ** cu/ni plated fabric acrylic conductive coated on both sides 4.7 ( 0.12) bonding and grounding two surfaces. emi shielding, static discharge draining. flexible and conformable design. cef-1** cu/ni plated fabric acrylic conductive 4.3 ( 0.11) bonding and grounding two surfaces. emi shielding, static discharge draining. flexible and conformable design. cef-3** cu/ni plated fabric acrylic conductive 4.7 ( 0.12) bonding and grounding two surfaces. emi shielding, static discharge draining. flexible and conformable design. cef-8** cu/ni plated fabric acrylic conductive coated on both sides 3.0 (0.075) bonding and grounding two surfaces. emi shielding, static discharge draining. flexible and conformable design. cef-3t** cef-3b** cu/ni plated fabric acrylic conductive 2.4 (0.06) grey 2.4 (0.06) black bonding and grounding two surfaces. emi shielding, static discharge draining. flexible and conformable design. 3m ? emi shielding sheets and films cu-10s** epoxy fr flm + copper foil none 6.7 ( 0.170 ) softened copper foil with fame-retardant flm on one side. excellent emi shielding for pcbs and assemblies. lightweight, fexible and easily die cut. **products are special order in the usa. please contact your 3m sales support for details. 3m offers a wide range of emi/rfi shielding tapes and absorbing materials, mesh and sleeving products, gaskets and conductive materials. 3m emi/em solutions foil and fabric tapes hard coating layer ito layer lcd glass driver lc al39ul emi custom foil tape solutions ? shielding ? grounding ? esd protection ? conformability ? ease of use in assembly ? customized thickness * for 3m custom solutions please contact your local 3m product specialist. products are special order. al39ul and 3006alb. ustomied and foil fabric tape options typical product constructions type 30 adhesive nonwoven embedded adhesive black/copper foil release liner 3006cubc black pet/al foil laminate release liner al39ul xy-axis conductivity xyz-axis conductivity
10 product backing adhesive total thickness mils (mm) features 3m ? aluminum foil 300pl 1.9 mil aluminum foil* acrylic non-conductive 3.0 (0.078) economical emi shielding aluminum foil tape. excellent adhesion and environmental resistance. 1120 2 mil aluminum foil acrylic conductive 4.0 (0.102) for emi shielding, static charge draining, grounding. good for cable wrap. easily die cut. 1170 2 mil aluminum foil acrylic conductive 3.2 (0.081) for emi shielding, static charge draining, grounding. easily die cut. 1178** 1.8 mil aluminum foil acrylic conductive 3.3 (0.084) emi shielding, static discharge draining and grounding. a l-25 b t * * 1 mil aluminum foil acrylic conductive 2.4 (0.061) for emi shielding, static charge draining, grounding. easily die cut. a l-25d c * * 1 mil aluminum foil acrylic conductive coated on both sides 3.3 (0.084) for emi shielding, static charge draining, grounding. easily die cut. a l- 5 0 b t * * 2 mil aluminum foil acrylic conductive 3.1 ( 0.079 ) for emi shielding, static charge draining, grounding. easily die cut. 1115b 4.5 mil aluminum foil acrylic conductive 6.0 ( 0.152) for emi shielding, grounding and static dissipation. 4.5 mil thickness provides excellent shielding and structural support characteristics. easily die cut. 3m ? aluminum foil laminated with polyester film a l-3 6 f r 1 mil aluminum foil + polyester flm acrylic conductive 2.4 (0.061) foil backing laminated with polyester flm. good resistance to oxidation, solvents and oils. easily die cut. a l-3 6 n c 1 mil aluminum foil + polyester flm acrylic non-conductive 2.2 (0.055) foil backing laminated with polyester flm. good resistance to oxidation, solvents and oils. easily die cut. a l-37 b l k * * 1 mil aluminum foil + black matte polyester flm acrylic conductive 2.8 (0.071) foil backing laminated with polyester flm. matte surface fnish. good electrical insulation, resistance to oxidation, solvents and oils. easily die cut. ce ap-1** 2.0 aluminum foil + pet flm acrylic non-conductive 3.2 (0.080) emi shielding, assembly aide tape. ceap-6b** 1.0-1.4 total aluminum foil + black pet flm acrylic conductive 2.6 (0.065) emi shielding, static discharge draining, grounding. 3m ? copper foil 508sn 1.4 mil copper foil acrylic non-conductive 3.2 (0.080) economical emi shielding on a wide range of applications. 1125 1.4 mil copper foil acrylic non-conductive 3.5 (0.089) for emi shielding on a wide range of applications. easily die cut. 1126 1.4 mil copper foil acrylic conductive 3.5 (0.089) for emi shielding, static charge draining when grounded. easily die cut. 1181 1.4 mil copper foil acrylic conductive 2.6 (0.066) for emi shielding, static charge draining, grounding. easily die cut. 1182 1.4 mil copper foil acrylic conductive coated on both sides 3.5 (0.089) typically used to bond two surfaces, both physically and electrically. also can provide emi shielding, static charge draining, grounding. easily die cut. 1183 1.4 mil tin-plated copper foil acrylic conductive 2.6 (0.066) oxidation resistant for long-term emi shielding, static charge draining, grounding. solderable and easily die cut. 1188** 1.3 mil copper foil acrylic conductive 2.9 (0.074) emi shielding, static discharge draining and grounding. 1194 1.4 mil copper foil acrylic non-conductive 2.6 (0.066) for emi shielding, static charge draining, grounding. easily die cut. cu-35c** 1.4 mil copper foil acrylic conductive 2.8 (0.07) for grounding and emi shielding. solderable and easily die cut. cec-2** 0.79 mil copper foil acrylic conductive coated on both sides 2.2 (0.055) emi shielding, static discharge draining and grounding. cec-2b** 1.18 mil copper foil acrylic conductive coated on both sides 3.6 (0.092) differential adhesion for side 1 vs side 2 for easier rework. emi shielding, static discharge draining, assembly of substrates and grounding. cec-3** 0.79 mil copper foil acrylic conductive 2.0 (0.05) emi shielding, static discharge draining and grounding. 3m ? embossed foil 1245 embossed copper foil acrylic non-conductive 4.0 (0.102) for emi shielding, static charge draining, grounding. solderable and easily die cut. 1267 embossed aluminum foil acrylic non-conductive 5.0 ( 0.127) for emi shielding, static charge draining, grounding. solderable and easily die cut. 1345 embossed tin-plated copper foil acrylic non-conductive 4.0 (0.102) oxidation resistant for long-term emi shielding, static charge draining, grounding. solderable and easily die cut. 2245** embossed copper foil acrylic conductive 4.0 (0.102) for grounding and emi shielding. solderable and easily die cut. 3245 reverse embossed copper foil acrylic conductive 5.9 ( 0.150 ) for emi shielding, static charge draining, grounding. solderable, easily die cut. these solutions include an innovative line of 3m ? electromagnetic compatible products that can control electromagnetic interference from internal sources, limit emi susceptibility from external sources and help manufacturers meet high certifcation standards around the world. ? provide electromagnetic compatibility ? shield or absorb electromagnetic and radio frequency interference ? ground sensitive electronic components and boards ? cushion components ? protect cables ? provide conductive properties 3m ? emc products can provide emi/rfi shielding and absorbing, static charge grounding, anti-static masking, cushioning, mechanical protection and conductive properties for a wide variety of applications. 3m emi/em solutions foil and fabric tapes *for information on the copper foil version of 300pl, contact your 3m representative. **products are special order in the usa. please contact your 3m sales support for details.
3 meta l antenna ta g antenna ta g eddy current generation (magnetic flux a ttenuation) 3m ffd m ma g netic flux meta l improve nfc/rfid antenna read range with 3m flux field directional materials (ffdm) improve power transfer effciency and range with 3m flux field directional materials (ffdm) 3m ? flux field irectional materials for f/rfi and ireless power applications transmit and read source antenna 3m solution: thin / high permeability, low signal loss ffdm (optimized to 13.56mhz) 3m flux field directional materials em80km and rfic30 improve em energy transfer via inductive coupling (short range) or magnetic coupled resonance (longer range) 3m flux field directional materials em16tf and rfic15 reduce eddy current losses and improve read range 3m solution: high permeability, low energy loss ffdm at operating frequencies 3m flux field directional materials receiving antenna coil sending antenna coil 3m ffdm 3m ffdm battery/metal b z 3m ? flux field irectional materials (ffm) for magnetic shielding applications 3m ffdms can be used to provide magnetic shielding of stray feld generating devices or materials that impact neighbor device or component performance (i.e. inductor, wireless power, etc.). antenna metal/battery antenna on polyimide carrier. em feld along y-axis in free space antenna with 3m ffdm between the antenna and metal/battery parts. em feld strength increased signifcantly with 3m ffdm use. antenna near metal or battery surface. em feld signifcantly reduced due to eddy current losses of em feld into the battery/metal parts. side view of antenna with 3m ffdm between antenna and metal/battery surface. 3m ffdm antenna 3m ffdm metal/ battery 25 20 1 5 1 0 5 0.1 1 1 0 frequency (mhz) shielding effectiveness (db) 100 vertical to mag field parallel to mag field h-field of device no magnetic shielding h-field of device ffdm magnetic shielding strong mag. field component near strong h-field component near weak h-field 3m ffdm sheet material strong mag. field weak mag. field 3m ffdm type em80km 0.02 mm soft magnetic layer thickness kec magnetic field test method 80 mm x 80 mm sample/40 mm plate s hole size 1 40 1 20 1 00 80 60 40 20 0 10m 100m frequency (hz) ab5016rf
problem solution higher frequencies require optimized grounding and faraday cage design inherent bond line thickness emi shielding using 3m ? electrically conductive adhesive transfer tape (ecatt) poor through tape emi shielding leads to lower emi se at high frequencies. standard electrically conductive tape leads to emi leakage through bond line tape thickness. 3m ecatt 9709sl metal thickness gap size or slit length 60db emi shielding 0.1mhz 50mh z 10hz 60db 3500 m 35 m 1000mhz (1ghz) 10000mh z (10ghz) grounding surface (r ok) grounding surfac e ( lower c o n tact r ) flex cir c u i t (fpc) f l ex c ircuit ( fpc ) grounding surface (r ok) grounding surfac e ( lower c o n tact r ) flex cir c u i t (fpc) f l ex c ircuit ( fpc ) 3m ecatt with inherent emi shielding at the bond line provides signifcantly reduced crosstalk, stray emi, noise in circuit, antennae effects, fpc susceptibility and spurious emissions. at high frequencies, the effect of through the tape thickness emi gaps or emi slits is to allow emi leakage. if the effective emi gap/slit does not = 0, emi energy at high frequency can pass through a standard conductive adhesive tape material via the gap related to the adhesive thickness. the tape bond line gap/slit leakage effect leads to poor emi shielding, cross-talk, degraded signal-to-noise ratio, etc. 4 mobile handheld & tablet emi/emc solutions 3m ecatt 9707, 9709s 3m ? electrically conductive gaskets ecg-7050/ecg-8055/msg-6100 3m multi-functional emi shielding, grounding and heat spreading solutions. hot device heat spreading & grounding, led heat spreading and attachment. emi and thermal management materials. flex printed circuit flex 3m ecatt 9709sl grounding surface substrate layer 3m electrically conductive adhesive transfer tape 9709sl used for fpc grounding and emi shielding as frequency increases, is the bond line gap leading to stray emi? ( cross talk, spurious emi, signal degradation and noise.)
9 contact resistance (r ohms) between a gold flexible test strip and a ss panel using the 3m ecatt bond line emi shielding (bond line gap/slit emi shielding potential) potential to improve contact r of a flex to a pcb grounding locations via improved surface conformability and xyz conductive potential with an ecatt product type vs. a generic z-axis only conductive psa adhesion to ss type substrate/3m tm/24 hour rt dwell ease of rework based on a standard set of substrates thermal conductivity (w/mk) or an effective thermal resistance (c/w) for a given thickness vs a generic z-axis only psa product gold fex bonded to ss using the ecatt. best results relate to a lower contact r potential on ss. contact r can vary with ss type tested as the oxide layer thickness on a ss type affects the fnal r results. see note 1. best = high db emi shielding in bond line gap/slit contact r between a flex and a pcb peel strength ecatt design can effect rework based on acrylic adhesive type & conductive fller type. effective thermal resistance and thermal conductivity vs a generic z-axis only psa. 9703 best good good better good 9704 best good best good good 9705 best good good better good 9706 best good best good good 9707 best best best best good best 9709 good best best good better best 9709s best best best good better best 9709sl best best best good better best 7805 good better good best better better 7850 good good good best good best 7772 better good good good good good 9712 good good good better good good 9713 better good good good good good 9719 good good good better good good 9720s better good good good good good 9723 better good better best good good 9750 best best best best good good 9732 best better better best good good 9760 best better better good best good 9764 better better good good best good 9780 better better good good best good these long-lasting adhesive transfer tapes can eliminate the need for screws and mechanical fasteners C while allowing the use of lighter, more compact fabric and layered foil shielding materials. and, unlike other electrically conductive adhesives that can be messy and diffcult to handle, 3m delivers advanced adhesive and conductive properties in an easy-to-use, pressure-sensitive tape that can be hand or machine applied and die cut to virtually any shape! 3m ? electrically conductive adhesive transfer tape (ecatt) selection process selection of grounding, emi shielding and attachment ecatts consists of determining several application requirements: for example, an ecatt general selection process could take into consideration items such as, but not limited to: 1 determine contact r target 2 defne contact surface type 3 adhesion level desired - from high- medium-standard adhesion, and high/low adhesion sided ecatts 4 bond line thickness 5 z or xyz conductive type ecatt 6 operating temperature range and environmental conditions 7 emi shielding in bond line gap/slit for high frequencies 8 determine contact area for ecatt used for r and adhesion of surfaces 9 assembly pressure, temperature and time limits 10 after assembly bond line stresses and need for added mechanical support
8 3m emi/emc solutions 3m ? electrically conductive adhesive transfer tapes 3m ? electrically conductive adhesive transfer tapes are designed to help you save time in a variety of specialized electronics assembly operations C from attaching emi shields and gaskets to grounding and bonding fexible circuits and pcbs C while improving the performance and reliability of your fnished products. 3m ecatt general overview comparative reference table ecatt basic comparative reference table: based on the suggested ecatt selection process, the end user should identify 2-4 ecatt products to test in an application to determine ftness for use. as each application is unique, it is diffcult to identify the optimum ecatt product without testing the ecatt products in an end use assembly design. the ecatt selection process of good-better-best ranks products as they might perform in a nominal application. as each ecatt may employ different conductive particles, scrim or non-woven, thickness variations, acrylic adhesive type, etc., they will perform differently based on end use application C hence the need for the end users own comparative testing. the following technical information and data should be considered representative or typical and should not be used for specifcation purposes. contact resistance (r ohms) between a copper foil test panel and a 2nd sheet of a copper foil test panel using the 3m ecatt contact resistance (r ohms) between a gold flexible test strip and a gold pad pcb panel using the 3m ecatt product pictorial design thickness (m) z or xyz conductivity (based on 3m test method) conductive filler type adhesive type features, advantages, and benefts copper foil bonded to a copper foil using the 3m ecatt / 3m 2-point resistance test method / 645 mm 2 overlap contact area / 1 hour rt dwell. see note 1. gold fex bonded to pcb gold test pad. 6 mm 2 overlap contact area. 1 hour rt dwell. see note 1. 9703 50 z silver low outgassing acrylic ecatt z- axis, low outgassing < 0.2 < 0.2 9704 50 z silver low outgassing acrylic ecatt z-axis, high adhesion, low outgassing < 0.2 < 0.2 9705 50 z silver standard acrylic ecatt z-axis, standard outgassing version of 9703 < 0.2 < 0.2 9706 50 z silver high adhesion acrylic ecatt high adhesion version of the 9705 < 0.2 < 0.3 9707 9707 50 xyz silver high adhesion acrylic ecatt high adhesion, bond line gap/slit emi shielding for high frequency, low contact r to ss < 0.2 < 0.3 9709 50 xyz silver standard acrylic ecatt standard adhesion, bond line gap/slit emi shielding for high frequency < 0.2 < 0.3 9709s 50 xyz silver standard acrylic ecatt standard adhesion, bond line gap/slit emi shielding for high frequency, low contact r to ss < 0.2 < 0.2 9709sl 50 xyz silver standard acrylic ecatt premium low liner release version of 9709s < 0.2 < 0.2 7805 150 xyz silver standard acrylic ecatt thicker ecatt for gap flling < 1.0 < 0.2 7850 150 xyz carbon high adhesion acrylic ecatt higher thermal conductivity & thicker ecatt for gap flling < 1.0 < 10.0 7772 66 xyz nickle & alum dc medium adhesion acrylic d/c double coated aluminum foil < 0.5 < 2.0 9712 125 xyz carbon standard acrylic ecatt non-woven conductive scrim & standard acrylic adhesive < 1.5 < 15.0 9713 89 xyz nickel/c standard acrylic ecatt lower r non-woven conductive scrim vs. 9712 & standard acrylic adhesive < 0.4 < 7.5 9719 100 xyz nickel/c silicone ecatt low surface energy silicone adhesive, higher temperature resistance, lower r non-woven conductive scrim vs. 9712 < 1.0 < 20.0 9720s 30 xyz nickel/cu high adhesion acrylic ecatt lower r non-woven conductive scrim vs. 9713, thinner scrim design & medium adhesion < 0.2 < 0.5 9723 60 xyz nickel/cu high adhesion acrylic ecatt lower r non-woven conductive scrim vs. 9713, thinner scrim design & high adhesion < 0.2 < 0.4 9750 50 xyz nickel/cu high adhesion acrylic ecatt lower r non-woven conductive scrim vs. 9713 & high adhesion < 0.2 < 0.5 9732 100 xyz nickel/cu medium adhesion acrylic ecatt lower r non-woven conductive scrim vs. 9713, thicker scrim design & high adhesion < 0.2 < 2.5 9760 50 xyz nickel/cu high / low adhesion double sided reworkable acrylic ecatt easier rework as greater face side to back side adhesion delta. easier rework version of 9725. high and low adhesion sides. < 0.2 < 0.8 9764 150 xyz nickel/cu high / low adhesion double sided reworkable acrylic ecatt easier rework as greater face side to back side adhesion delta. easier rework and thicker version of 9732. high and low adhesion sides. < 0.5 < 5.0 9780 200 xyz nickel/cu high / low adhesion double sided reworkable acrylic ecatt easier rework as greater face side to back side adhesion delta. easier rework and thicker version of 9732. high and low adhesion sides. < 0.5 < 5.0 note 1: test & performance results will vary based on items such as, but are not limited to: contact area; assembly method; testing conditions; normal variations in product performance from one mfg. lot to a different mfg. lot of material C along with the normal variations found in a material within a mfg. lot (i.e., thickness, available conductive material in an actual sample tested, variations in conductive fller materials and uniformity of conductive materials dispersed within a lot of material, variations in adhesives, etc.); test methods; environmental aging; exact test surface material type utilized, etc. the copper to copper & gold flex to pcb testing also should be noted for the differences related to the contact area difference in the test methods (645 mm 2 vs. 6 mm 2 ) as this does impact the test results. testing of ecatt materials and the noted test substrates does not imply that the ecatt is suitable for an end use application of similar materials. end user is responsible to determine if an ecatt and substrate combination is ft for use in their intended end use application. note 2: more ecatt options are available. chart references typical type options. contact your 3m technical service representative for more details.
5 3m ? emi custom foil tape al39ul/3006alb 3m emi absorbers ab5100/ab6005/ ab7050 to reduce emi noise within device. 3m ? flux field directional material ab5016rf/rfic15 for improved nfc & rfid performance. 3m flux field directional material rfic/em16tf/em80km for improved wireless power effciency. hard coating layer ito layer lcd glass driver lc al39ul 3m ? emi absorbers ab5100/ab6005/ab7050 to reduce emi noise level on fex/connector. b z is grounding bias degrading your antenna or data fex signal to noise (s/n) performance? problem solution electrical bias degrades performance poor antenna or data flex signal/noise ratio effectively ground device optimized signal/noise ratio grounding not effective a n tenn a sig nal data fle x + 2 . 0 v + 0 . 0 v ground i n t e rnal device bias n o device bias a ntenn a sig nal data flex +0.0 v + 0 . 0 v g r o u n d assembly optimized for grounding using 3m ecatt grounding not effective a n tenn a sig nal data fle x + 2 . 0 v + 0 . 0 v ground i n t e rnal device bias n o device bias a ntenn a sig nal data flex +0.0 v + 0 . 0 v g r o u n d assembly optimized for grounding using 3m ecatt if device is not well grounded, the bias voltage in the device acts as a transmitter of a signal that the signal line fex, antenna fex, etc. pick up, leading to poor s/n performance and higher error rates. device is well grounded so the bias voltage in the device is baseline and no rf signal is emitted. optimized antenna and data fex s/n performance. 3m ecatt 9707, 9709s, 9720s and 9750
6 3m emi/emc solutions electrically conductive cushioning gasket selections 3m ? electrically conductive gaskets solutions encompass three distinct product types: ? 3m electrically conductive gaskets (ecg) : single coated and double coated conductive foam products (less than 1mm thickness) ? 3m metal shielding gaskets (msg) : very soft single coated conductive foam products with a metal carrier (greater than 1 mm thickness). ? 3m electrically conductive acrylic pads (ecap ): solid core single coated acrylic conductive gaskets with a conductive fabric carrier (less than 1 mm thickness). the 3m ecg series has two versions. the single coated version ecg-70xx and the double coated version ecg-80xx. the 3m msg products are available in greater than 1mm thickness with a metal carrier layer that is either a metal foil or a magnetic foil type. the ecap product 7830n is an acrylic conductive ecatt with a conductive fabric carrier layer to make a single sided ecap gasket product. product conductive carrier type conductive adhesive / fillers conductive core total thickness (mm) features ecap 7830n conductive fabric acrylic adhesive with ni coated graphite fller / 1 side, single coated acrylic adhesive with ni coated graphite fller 0.2, 0.3, 0.4, 0.5 xyz electrical conductivity, single sided, provides emi shielding and grounding, good adhesion to many substrates. ecg-70xx (ex: ecg-7033) conductive fabric acrylic adhesive with ni fller / 1 side, single coated metal plated open cell urethane foam 0.33, 0.53, 0.73 (0.xx) xyz electrical conductivity, conformable-soft, single sided, provides emi shielding and grounding, good adhesion to many substrates, single sided adhesive. ecg-80xx (ex: ecg-8035) conductive fabric acrylic adhesive with ni fller / 2 sided, double coated metal plated open cell urethane foam 0.35, 0.55, 0.75 (0.xx) xyz electrical conductivity, conformable-soft, provides emi shielding and grounding, good adhesion to many substrates, dual sided adhesive. msg-6xxx (msg-6180) metal foil acrylic adhesive with ni fller / 1 side, single coated metal plated open cell foam 0.6, 1.0, 1.8 (optional thicknesses/ inquire @ 3m) xyz electrical conductivity, very conformable-soft, single sided, provides emi shielding and grounding, good adhesion to many substrates, single sided adhesive 3m ? electrically conductive cushioning gasket ecg-8035, ecg-8055, ecg-8075, double coat 3m ? electrically conductive cushioning gasket ecg-7033, ecg-7053, ecg-7073, single coat onductive03 onductive03 3m emi absorbers & 3m grounding solutions for optimized antenna performance 3m emi absorbers and 3m ecatt grounding solutions (conductive psa ecatt, conductive foils & fabrics) provide for an optimized antenna performance solution. absorbers reduce line of sight or refected emi noise near an antenna, conductive psas and gaskets offer grounding for a thickness range potential of 0.03 mm to 3.3 mm gaps, to reduce stray fowing currents and associated emi that degrades antenna performance (s/n). 3m ? emi absorbers wifi receiver/transmitter wifi receiver/transmitter communication signal disrupted by ic emi antenna emi noisy ic devices 3m emi absorbers strong signal signal to noise ratio poor optimized signal to noise ratio poor optimized
7 3m wide frequency emi absorbers (ab) and 3m flux field directional materials (ffdm) C specifc target application frequency range 3m emi absorbers (ab) for wide frequency applications: ? 3m emi absorbers are used to reduce emi and rf noise in electronic systems. 3m emi absorbers can be applied to noisy traces, ics and refective surfaces in an enclosure. 3m flux field directional materials (ffdm): wireless power, nfc, magnetic shielding digitizer, and hac ? 3m ffdm products are useful for rfid and nfc applications to de-couple the nfc or rfid antenna from metal surfaces by directing the antenna fux felds away from the metal object or surface. 3m ffdm products can also be benefcial in wireless power systems to enhance power transfer effciency between primary sending and receiving antenna coils. ffdms such as em80km also are useful as magnetic feld shielding materials in a thin format. 3m wide frequency emi absorbers (ab) product carrier binder polymer and filler adhesive type magnetic permeability @ 1 mhz absorber thickness only (mm) features ab-5000 series flexible polyethylene resin with magnetic fllers acrylic psa 30 0.1, 0.2, 0.3, 0.5, 1.0 example: ab-5000 series @ 0.50 mm absorber thickness (without psa) =ab-5050 reduce emi and rf noise in electronic systems. apply to noisy traces, ics and refective surfaces in an enclosure. ab-5000s series flexible polyethylene resin with magnetic fllers acrylic psa 55 0.1, 0.2, 0.3, 0.5, 1.0 improved lower frequency absorber vs. ab-5000 (@ < 1-2 ghz). reduce emi and rf noise in electronic systems. apply to noisy traces, ics and refective surfaces in an enclosure. ab-5000hf series flexible poly resin with magnetic fllers acrylic psa 30 0.1, 0.2, 0.3, 0.5, 1.0 halogen free version of the ab-5000 ab-5000shf series flexible poly resin with magnetic fllers acrylic psa 55 0.1, 0.2, 0.3, 0.5, 1.0 halogen free version of the ab-5000s ab-6000 series flexible poly resin with magnetic fllers laminated to aluminum foil/ emi shielding & absorbing combination. acrylic psa or conductive acrylic psa varies see tds ab-6000 series combines an emi shielding layer with an emi absorbing layer. layer confguration can vary. ab-6000 series can be used as an emi "shielding can/ faraday cage" design when other options are not practical. halogen free version available (ab-6000hf series). note: ultra thin version of design is available as 3m afm. 3m afm uses a foil and thin ferrite design @ 0.05 mm C 0.12 mm. ab-7000 series flexible polyethylene resin with magnetic fllers acrylic psa 110-120 0.05, 0.10, 0.20, 0.30, 0.50 note: ex: ab-7000 series @ 0.30 mm absorber thickness (without psa) = ab-7030 improved lower frequency absorber vs the ab-5000 or ab-5000s (@ < 1 ghz). reduce emi and rf noise in electronic systems. apply to noisy traces, ics and refective surfaces in an enclosure. halogen free version available (ab-7000hf series). 3m flux field directional materials (ffdm) - specifc target application frequency range product carrier binder polymer and filler adhesive type magnetic permeability @ 13.56 mhz features ab-5000r series (em45ep) flexible polyethylene resin with magnetic fllers acrylic psa 45 - 50 ab-5000r series ffdm materials are designed for rfid and nfc applications to de-couple the nfc or rfid antenna from metal surfaces by directing the antenna fux felds away from the metal object or surface. products can also be evaluated for wireless power systems to enhance power transfer effciency between primary sending and pick-up antenna coils. products include: ab-5010r @ 0.15 mm/ab-5020r @ 0.2 mm. em16tf sintered ferrite sheet between carrier flms with optional psa acrylic psa 160 em16tf series ffdm materials are designed for rfid and nfc applications to de-couple the nfc or rfid antenna from metal surfaces by directing the antenna fux felds away from the metal object or surface. products can also be evaluated for wireless power systems to enhance power transfer effciency between primary sending and pick-up antenna coils. products include: em16tf @ different overall thicknesses (see tds). ab-5000rf series (em10tf) sintered ferrite sheet between carrier flms with optional psa acrylic psa 105 ab-5000rf series ffdm materials are designed for rfid and nfc applications to de-couple the nfc or rfid antenna from metal surfaces by directing the antenna fux felds away from the metal object or surface. products can also be evaluated for wireless power systems to enhance power transfer effciency between primary sending and pick-up antenna coils. products include: ab- 5016rf@0.16 mm /ab-5026rf@0.26 mm. thinner options are available. rfic series (em42ep) flexible polyethylene resin with magnetic fllers acrylic psa 42 rfic series ffdm materials are designed for rfid and nfc applications to de-couple the nfc or rfid antenna from metal surfaces by directing the antenna fux felds away from the metal object or surface. products can also be evaluated for wireless power systems to enhance power transfer effciency between primary sending and pick-up antenna coils. products include: rfic-xx @ 0.13 mm - 0.33 mm @ multiple thicknesses. see tds for details. em13tf sintered ferrite sheet between carrier flms with optional psa acrylic psa 130 emxxtf series ffdm materials are designed to be evaluated for wireless power systems to enhance power transfer effciency between primary sending and pick-up antenna coils. optional uses include rfid and nfc applications to de-couple the nfc or rfid antenna from metal surfaces by directing the antenna fux felds away from the metal object or surface. products include: em13tf @ different overall thicknesses (see tds). em80km high permeability magnetic foil with cover flm & psa acrylic psa 80,000 max em80km series ffdm materials are designed for dc and low frequency magnetic feld shielding to be evaluated for wireless power systems to enhance power transfer effciency between primary sending and pick-up antenna coils. products include: em80km @ 0.12 mm (thinner versions and optional multi-layer designs are available for optimized thickness and fux feld interaction). note: reference em # # letter-letter (i.e., em80km) - em = electro-magnetic - # # = permeability peak - 1st letter: k=x1000, h=x100, t=x10, e=x1 - 2nd letter = em material type: m= magnetic foil, f = ferrite, p = polymer composite with magnetic fllers. after em##ll, the product is identifed by overall thickness in mm (ttt) and one- or two-sided adhesive (a). example: em45ep @ 0.15 mm thickness with psa on one side = em45ep-ttt-a = em45ep-015-1 note that ferrite type always has a flm on the non-psa side. * see technical data sheet (tds) for added adhesive thickness for each version.
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